Change the process,
competitiveness changes.
Business
We do not stop at supplying machines. We mass-produce with the same machines to prove the technology,
and propose only floor-proven solutions for your line.
Business Areas
Exclusive Korean distributor of the Mirae MAI Series. We supply odd-form insertion machines and dedicated feeders — with installation, commissioning and after-service.
Complete SMT line construction — high-speed chip mounters, screen printers, reflow and inspection equipment.
Real-time production monitoring, MES integration and automated control build an intelligent manufacturing environment.
Production automation through odd-form insertion equipment and articulated industrial robot applications.
Custom automation equipment, material transfer and inspection systems — engineered and built with our own technology.
Reel, stick, tray, bulk — 16 J-Series feeder models designed and built in-house for every package type.
Send the component and we measure, design and build — custom nozzles in gripper, suction, SMD and robot-gripper types.
Semiconductor process jigs designed and built, with maintenance materials and consumables supplied reliably.
AI Factory
The data your machines generate all day is not discarded — it is fed back into the process. AI software development is one of JSOLUTION's registered business areas, and we are a member of the Korea AI Robot Industry Association.
Real-time data collection and analysis via MES
AI algorithms optimizing the production process
Predictive maintenance (PdM) for equipment
Real-time defect detection with vision AI
Inspection accuracy improved by big-data learning
Fully automated quality traceability
Production planning with AI demand forecasting
Automated optimal production scheduling
Inventory optimization and shorter process lead times
PCB Assembly — Mounting Technology
On the very same PCB, how a component is mounted depends on its shape and how it is supplied. SMD bonds to the surface, Through-hole inserts and clinches through the board, and odd-form insertion places parts no standard machine can handle, fed by dedicated feeders. Here are the technical conditions of all three.
Comparison
| Item | SMD Surface Mount | Through-hole | Odd-form |
|---|---|---|---|
| Part types | Leadless and fine-pitch chips and packages | Standard leads (axial, radial, DIP) | Odd-shaped, large, irregular lead layouts |
| Supply form | Reel tape, tray, stick | Taped reels | Reel, stick, tray, bulk, magazine — dedicated per part |
| Equipment | Chip mounter (pick & place) | Auto inserter (AI) | Odd-form inserter + dedicated feeders |
| Joining process | Reflow soldering (235–250°C) | Wave and selective soldering | Selective soldering, press-fit, clinching |
| Placement precision | ±25~50μm | ±0.1 mm class | ±0.05 mm (laser-measured correction) |
| Mechanical strength | Moderate | High (through + clinch) | High (part-specific retention) |
| High current · heat | Limited | Favorable | Favorable (power and magnetic parts) |
| Inspection | SPI · AOI · X-ray | AOI · ICT | Vision alignment · ZHMD · OCR · insertion-force monitoring |
| Control points | Paste volume, thermal profile, voids | Barrel fill, lead entry, polarity | Feeder alignment, lead-shape variance, part drop |
Line Sequence
Application
As the EV industry accelerates, THT components in BMS and other core parts remain critical. High throughput and precision control that senses the finest component variations cut cost and maximize productivity.
Solutions specialized for THT automation at the heart of appliance manufacturing — TVs, refrigerators, ovens. Optimized for appliance PBAs including power modules.
For medical devices demanding the highest reliability, such as life support, we minimize manual error and maximize PBA accuracy and efficiency.
For defense equipment that must perform in extreme environments — communications, radar, guided systems — we raise PBA reliability and efficiency.
Semiconductor process jigs designed and built, and power-control boards precision-mounted. Cleanroom-ready assembly and test lines meet semiconductor quality standards.
AI growth and data-center expansion drive demand for high-density, high-power control. Precise insertion and consistent quality control keep heat to a minimum.
Inverters and converters, the heart of solar power. Precision THT mounting of high-voltage, high-current parts underpins stable conversion.
THT (PBA) Process Line
Machines, robots and automation bound into one line that flows from loading to soldering without human intervention.
Automatic loading by jig
Corrected mounting and insertion inspection
Transfer to continuous soldering
PCB Assembly
Cheonan Electronics Solution Group SMT dual line — thirteen processes from magazine loader to unloader.
| Process | Model | Maker | Notes |
|---|---|---|---|
| Magazine loader | S series | Company S | PCB loading |
| Vacuum loader | S series | Company S | Faster bare-board loading |
| Laser marker | L series | Company S | PCB serial marking and trace lookup |
| Screen printer | H series | Company S | Print precision 20–25 µm |
| SPI | S series | Company P | Inline 3D solder paste inspection |
| Mounters 1·2·3 | D series | Company P | Chip-dedicated dual lane, 46,000 cph |
| Mounter 4 | T series | Company P | Odd-form dedicated, 5,900 cph |
| Reflow | 1900 series | Company H | Solder paste soldering |
| 3D AOI | A series | Company P | 100% inline inspection of mounting and soldering |
| Unloader | S series | Company S | Stack and discharge |
| Process | Model | Maker | Notes |
|---|---|---|---|
| Magazine loader | E series | Company E | PCB loading |
| ICT | D series | Company D | Circuit test of mounted parts, wrong-part detection |
| Coater 1 | E series | Company E | First coating |
| AOI 1 | T series | Company P | Coating inspection |
| Cure oven 1 | E series | Company E | Natural coating cure |
| Flipper 1 | E series | Company E | Board flip for second-side coating |
| Coater 2 | A series | Company I | Second coating |
| AOI 2 | T series | Company P | Coating inspection |
| Cure oven 2 | E series | Company E | Natural coating cure |
| Flipper 2 | E series | Company E | Board flip for routing |
| Router | P series | Company I | Guided routing |
| Transfer unit | P series | Company S | Finished boards stacked in anti-static trays |
Thirteen processes run inline: ICT, first coating, AOI, cure, flip, second coating, AOI, cure, through to routing.
